Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2002
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Application #:
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09524148
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Filing Dt:
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03/14/2000
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Inventor:
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Kevin Kwong-Tai Chung
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Title:
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HIGH-DENSITY ELECTRONIC PACKAGE, AND METHOD FOR MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 70 WASHINGTON ROAD |
| PRINCETON JUNCTION, NEW JERSEY 08550 |
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| DANN, DORFMAN, HERRELL AND SKILLMAN, P.C |
| CLEMENT A. BERARD |
| 1601 MARKET STREET |
| SUITE 720 |
| PHILADELPHIA, PA 19103-2307 |
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