Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2002
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Application #:
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09618261
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Filing Dt:
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07/18/2000
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Inventors:
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Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Subhash Gupta, Yakub Aliyu, Mei Sheng Zhou et al
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Title:
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METHOD OF APPLICATION OF CONDUCTIVE CAP-LAYER IN FLIP-CHIP, COB, AND MICRO METAL BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLAND INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 73840 |
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| GEORGE O.SAILE |
| 20 MCINTOSH DRIVE |
| POUGHKEEPSIE, NY 12603 |
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