Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2002
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Application #:
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08973029
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Filing Dt:
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02/24/1998
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Publication #:
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Pub Dt:
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03/21/2002
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Inventors:
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MANABU HIRAKAWA, KENICHI OHKAWA, TERUHIKO DOI, TETSUYA HISAYAMA, YUICHI MIYAKE et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND INJECTION MOLDED ARTICLE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME |
| CHUO-KU, OSAKA, JAPAN |
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| 1, TOYOTACHO |
| TOYOTA-SHI, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| WADDELL A. BIGGART |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3202 |
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