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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6384674
Issue Dt:
05/07/2002
Application #:
09353349
Filing Dt:
07/15/1999
Publication #:
20020000873
Pub Dt:
01/03/2002
Inventors:
HIROAKI TANIZAKI, TSUKASA OOISHI, SHIGEKI TOMISHIMA, MASATOSHI ISHIKAWA, HIDETO HIDAKA et al
Title:
SEMICONDUCTOR DEVICE HAVING HIERARCHICAL POWER SUPPLY LINE STRUCTURE IMPROVED IN OPERATING SPEED
Assignment: 1
Reel/Frame:
010107/0047Recorded: 07/15/1999Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TANIZAKI, HIROAKI
Exec Dt:
07/01/1999
OOISHI, TSUKASA
Exec Dt:
07/01/1999
TOMISHIMA, SHIGEKI
Exec Dt:
07/01/1999
ISHIKAWA, MASATOSHI
Exec Dt:
07/01/1999
HIDAKA, HIDETO
Exec Dt:
07/01/1999
TSUJI, TAKAHARU
Exec Dt:
07/01/1999
Assignee:
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO100-8310, JAPAN
Correspondent:
MCDERMOTT, WILL & EMERY
STEPEHN A. BECKER
600 13TH STREET, NW
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
025980/0219Recorded: 03/18/2011Pages: 67
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MITSUBISHI DENKI KABUSHIKI KAISHA
Exec Dt:
03/07/2011
Assignee:
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI,
KANAGAWA, JAPAN 211-8668
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 THIRTEENTH STREET, N.W.
WASHINGTON, DC 20005-3096

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