Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09476666
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Filing Dt:
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12/30/1999
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Inventor:
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DAVID NAGHSKI
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Title:
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HIGH DENSITY MULTIPLE CHIP FIBER ARRAY CONNECTOR
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| ONE EAST FIRST STREET |
| RENO, NEVADA 89501 |
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| STEVEN H. MEYERS, ESQ. |
| WOODCOCK WASHBURN LLP |
| ONE LIBERTY PLACE, 46TH FLOOR |
| 1650 MARKET STREET |
| PHILADELPHIA, PA 19103-7301 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE EAST FIRST STREET |
| RENO, NEVADA 89501 |
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| WOODCOCK WASHBURN KURTZ MACKIEWICZ ETAL |
| LAWRENCE A. AARONSON |
| ONE LIBERTY PLACE - 46TH FLOOR |
| 1650 MARKET STREET |
| PHILADELPHIA, PENNSYLVANIA 19103-7301 |
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