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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/14/2002
Application #:
09522803
Filing Dt:
03/09/2000
Inventors:
Daniel Yap, Phillip H. lawyer
Title:
METHOD FOR MANUFACTURING PRECISION ELECTROPLATED SOLDER BUMPS
Assignment: 1
Reel/Frame:
010670/0584Recorded: 03/10/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/07/2000
Exec Dt:
03/07/2000
Assignee:
3011 MALIBU CANYON ROAD
MALIBU, CALIFORNIA 90265
Correspondent:
LADAS & PARRY
VICTOR PEPKIN
5670 WILSHIRE BOULEVARD, #2100
LOS ANGELES, CA 90036

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