Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09806828
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Filing Dt:
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04/05/2001
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Inventors:
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Shigeru Ichiba, Yutaka Nakata, Kazuhiko Shimada
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Title:
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NON-PERFLUORO FLUORINE-CONTAINING RESIN MOLDED ARTICLE HAVING
LOW-TEMPERATURE HEAT-SEALING PROPERTY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UMEDA CENTER BUILDING, 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA 530-8323, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK, ET AL |
| ABRAHAM J. ROSNER |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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