Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09417662
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Filing Dt:
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10/14/1999
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Inventors:
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HIDEKI IWAKI, YUTAKA TAGUCHI, TETSUYOSHI OGURA
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Title:
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MULTI-LEVEL CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING SAME AND METHOD FOR ADJUSTING A CHARACTERISTIC IMPEDANCE THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA |
| OSAKA 571-8501, JAPAN |
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| THEIEN REID & PRIEST LLP |
| 701 PA. AVE. NW. |
| STE. 800 |
| WASH DC. 20004 |
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