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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/28/2002
Application #:
09454594
Filing Dt:
12/07/1999
Inventors:
Hiroyuki Kamada, Hiroyuki Kawahara, Ichiro Nakao, Takehiro Hirai
Title:
Semiconductor device and method for fabricating the same
Assignment: 1
Reel/Frame:
010614/0533Recorded: 03/13/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/07/2000
Exec Dt:
02/07/2000
Exec Dt:
02/07/2000
Exec Dt:
02/07/2000
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8
Correspondent:
NIXON PEABODY LLP
ERIC J. ROBINSON
8180 GREENSBORO DRIVE, SUITE 800
MCLEAN, VIRGINIA 22102
Assignment: 2
Reel/Frame:
032152/0514Recorded: 02/03/2014Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/17/2014
Assignee:
C/O SAKURA SOGO JIMUSHO
1-11 KANDA-JINBOCHO, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVE. NW
SUITE 800
WASHINGTON, DC 20037-3213

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