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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/28/2002
Application #:
09548534
Filing Dt:
04/13/2000
Inventor:
Yueh-liang Liu
Title:
MACHINE FOR ETCHING THE EDGE OF A WAFER AND METHOD OF ETCHING THE EDGE OF A WAFER
Assignment: 1
Reel/Frame:
010739/0071Recorded: 04/13/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/06/2000
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO. 4, CREATION ROAD III
HSINCHU, TAIWAN R.O.C
Correspondent:
LADAS & PARRY
RICHARD P. BERG
5670 WILSHIRE BOULEVARD, #2100
LOS ANGELES, CA 90036-5679

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