Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09667202
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Filing Dt:
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09/21/2000
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Inventors:
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Michihisa Tasaka, Toshimi Yamanaka
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Title:
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THERMOPLASTIC ELASTOMERIC RESIN COMPOSITION AND A GRANULE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-5, NIHONBASHI-HONCHO 3-CHOME |
| CHUO-KU, TOKYO 103-0023, JAPAN |
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| PITNEY, HARDIN, KIPP & SZUCH LLP |
| GERALD LEVY |
| 711 THIRD AVENUE |
| NEW YORK, NEW YORK 10017 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 3-11-5 NIHONBASHI-HONCHO |
| CHUO-KU TOKYO, JAPAN |
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| PITNEY, HARDIN, KIPP & SZUCH LLP |
| GERALD LEVY |
| 685 THIRD AVENUE |
| NEW YORK, NY 10017 |
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