Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/25/2002
|
Application #:
|
09186757
|
Filing Dt:
|
11/05/1998
|
|
Inventors:
|
NIEN-YU TSAI, HONG-LONG CHANG, CHUN-WEI CHEN, MING-LI KUNG
|
|
Title:
|
METHOD OF FORMING TUNGSTEN INTERCONNECT AND VIAS WITHOUT TUNGSTEN LOSS DURING WET STRIPPING OF PHOTORESIST POLYMER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 19 LI-HSIN ROAD |
| HSINCHU, TAIWAN R.O.C |
|
|
|
| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 19 LI-HSIN ROAD |
| HSINCHU, TAIWAN |
|
|
|
| SCIENCE-BASED INDUSTRIAL PARK |
| WITTLESBACHERPLATZ 2 |
| MUCHEN, GERMANY D-803 |
|
|
|
|
| CHRISTENSEN O'CONNOR |
| CHUN M. NG, ESQ. |
| JOHNSON & KINDNESS PLLC |
| 1420 FIFTH AVENUE, SUITE 2800 |
| SEATTLE, WA 98101-2347 |
|
|
Search Results as of:
05/13/2024 04:21 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
