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Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
Issue Dt:
07/02/2002
Application #:
09446764
Filing Dt:
12/23/1999
Inventors:
HIROKUNI HIYAMA, KAZUTO HIROKAWA, HISANORI MATSUO, YUTAKA WADA
Title:
ABRADING PLATE AND POLISHING METHOD USING SAME
Assignment: 1
Reel/Frame:
010593/0965Recorded: 12/23/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/20/1999
Exec Dt:
12/20/1999
Exec Dt:
12/20/1999
Exec Dt:
12/20/1999
Assignee:
11-1, HANEDA ASAHI-CHO, OHTA-KU
TOKYO, JAPAN
Correspondent:
WENDEROTH, LIND & PONACK, LLP
JEFFREY NOLTON
2033 "K" STREET, N.W., SUITE 800
WASHINGTON, D.C. 20006

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