Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/02/2002
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Application #:
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09495699
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Filing Dt:
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02/01/2000
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Inventor:
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Hisashi Takeda
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Title:
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INTERPOSER FOR SEPARATING STACKED SEMICONDUCTOR CHIPS MOUNTED ON A MULTI-LAYER PRINTED CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 460, OAZA KOYAMA |
| SUZAKA-SHI, NAGANO 382-8501, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI, MCLELAND |
| RONALD F. NAUGHTON |
| SUITE 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, D.C. 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN |
| OAZA KURITA |
| NAGANO-SHI, NAGANO, 380-0921, JAPAN |
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| ARMSTRONG, WESTERMAN & HATTORI, LLP |
| WILLIAM G. KRATZ, JR. |
| 1725 K STREET, N.W., SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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