Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09583514
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Filing Dt:
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05/31/2000
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Inventors:
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Kie Y. Ahn, Leonard Forbes
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Title:
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Multilevel copper interconnects with low-k dielectrics and air gaps
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH |
| EDWARD J. BROOKS, III |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 1042 |
| MOUNT KISCO, NEW YORK 10549 |
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| RICHARD J. BOTOS |
| LERNER, DAVID, LITTENBERG, KRUMHOLZ ET AL. |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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