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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/30/2002
Application #:
09410744
Filing Dt:
10/01/1999
Inventors:
HIDEAKI HIRABAYASHI, NAOAKI SAKURAI, TOSHITSURA CHO, SHUMPEI SHIMIZU, KATSUHIRO KATO et al
Title:
COPPER-BASED METAL POLISHING COMPOSITION, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, POLISHING COMPOSITION, ALUMINUM-BASED METAL POLISHING COMPOSITION, AND TUNGSTEN-BASED METAL POLISHING COMPOSITION
Assignment: 1
Reel/Frame:
010320/0041Recorded: 10/01/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/22/1999
Exec Dt:
09/22/1999
Exec Dt:
09/22/1999
Exec Dt:
09/22/1999
Exec Dt:
09/22/1999
Exec Dt:
09/22/1999
Assignees:
72 HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, JAPAN
12-1 EKIMAEHONCHO, KAWASAKI-KU
KAWASAKI-SHI, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND ET AL
C. IRVIN MCCLELLAND
FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VIRGINIA 22202

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