Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09840725
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Filing Dt:
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04/23/2001
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Publication #:
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Pub Dt:
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12/20/2001
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Inventors:
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Shin Kim, Hee-Guk Choi, Se Yong Oh, Se Ill Kim
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Title:
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METHOD FOR MANUFACTURING A CHIP SCALE PACKAGE HAVING SLITS FORMED ON A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-KU, SUWON-CITY |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OR 97205 |
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