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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/13/2002
Application #:
09660558
Filing Dt:
09/12/2000
Inventor:
Amit K. Sarkhel
Title:
ELECTRONIC PACKAGE INTERCONNECT STRUCTURE COMPRISING LEAD-FREE SOLDERS
Assignment: 1
Reel/Frame:
011147/0584Recorded: 09/12/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/12/2000
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
LAWRENCE R. FRALEY
IPLAW N50/40-4
1701 NORTH STREET
ENDICOTT, NY 13760
Assignment: 2
Reel/Frame:
028959/0001Recorded: 09/13/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306
Assignment: 3
Reel/Frame:
051446/0476Recorded: 12/30/2019Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2019
Assignee:
1 TERMINAL DRIVE
PLAINVIEW, NEW YORK 11803
Correspondent:
ALAN P KASS
394 ELIZABETH AVENUE
SOMERSET, NJ 08873

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