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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/20/2002
Application #:
09580699
Filing Dt:
05/30/2000
Inventor:
Hiroshi Sakurai
Title:
RESIN-MOLDING MOLD UNIT AND RESIN-MOLDING APPARATUS PROVIDED WITH THE RESIN-MOLDING MOLD UNIT
Assignment: 1
Reel/Frame:
010834/0839Recorded: 05/30/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/2000
Assignee:
7-1 SHIBA 5-CHOME MINATO-KU
TOKYO, JAPAN
Correspondent:
HUTCHINS, WHEELER & DITTMAR
DONALD W. MUIRHEAD
101 FEDERAL STREET
BOSTON, MA 02110
Assignment: 2
Reel/Frame:
013774/0295Recorded: 02/25/2003Pages: 30
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI, KANAGAWA 211-8668, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
WASHINGTON, DC 20037

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