Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09599101
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Filing Dt:
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06/08/2000
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Inventors:
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Takaki Kuno, Hirotaka Okamoto, Shoji Yamamoto, Teikou Odashima
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Title:
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METHOD OF RESIN SEALING A GAP BETWEEN A SEMICONDUCTOR CHIP AND A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN |
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| 72, HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN |
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| FASSE PATENT ATTORNEYS, P.A. |
| WALTER F. FASSE |
| INDIAN POND LANE |
| ST. ALBANS, ME 04971 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| FASSE PATENT ATTORNEYS, P.A. |
| PO BOX 726 |
| HAMPDEN, ME 04444-0726 |
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