Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09892004
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Filing Dt:
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06/26/2001
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Publication #:
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Pub Dt:
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05/02/2002
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Inventors:
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Hirotoshi Tanimura, Keiichi Ohtsubo, Shinji Ueno
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Title:
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ELECTRONIC PACKAGE WITH PLURALITY OF SOLDER-APPLIED AREAS PROVIDING HEAT TRANSFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION, N50/040-4 |
| LAWRENCE R. FRALEY |
| 1701 NORTH STREET |
| ENDICOTT, NY 13760 |
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