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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/03/2002
Application #:
09879171
Filing Dt:
06/12/2001
Inventor:
Todd O. Bolken
Title:
TWO STAGE TRANSFER MOLDING METHOD TO ENCAPSULATE MMC MODULE
Assignment: 1
Reel/Frame:
011900/0390Recorded: 06/12/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/05/2001
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
TRASK BRITT
JAMES R. DUZAN
P.O. BOX 2550
SALT LAKE CITY, UTAH 84110-2550
Assignment: 2
Reel/Frame:
023786/0416Recorded: 01/04/2010Pages: 274
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/23/2009
Assignee:
26 DEER CREEK LANE
MT. KISCO, NEW YORK 10549
Correspondent:
CHRISTOPHER C. HENRY
ROPES & GRAY LLP
1211 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036

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