Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09846339
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Filing Dt:
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05/02/2001
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Publication #:
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Pub Dt:
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04/11/2002
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Inventors:
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Akira Ihsikawa, Tatsuya Senga, Akira Miyaji, Yoshijiro Ushio
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Title:
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POLISHING BODY, POLISHING APPARATUS, POLISHING APPARATUS ADJUSTMENT METHOD, POLISHED FILM THICKNESS OR POLISHING ENDPOINT MEASUREMENT METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, |
| TOKYO 100-1005, JAPAN |
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| MORGAN, LEWIS & BOCKIUS LLP |
| ROBERT J. GAYBRICK |
| 1800 M STREET, N.W. |
| WASHINGTON, D.C. 20036 |
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