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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/01/2002
Application #:
09310875
Filing Dt:
05/12/1999
Publication #:
Pub Dt:
03/14/2002
Inventor:
SAMIT S. SENGUPTA
Title:
COMPOSITIONS FOR IMPROVING INTERCONNECT METALLIZATION PERFORMANCE IN INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
009965/0279Recorded: 05/12/1999Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/12/1999
Assignee:
1109 MCKAY DRIVE
SAN JOSE, CALIFORNIA 95131
Correspondent:
MARTINE PENILLA & KIM, LLP
ALBERT S. PENILLA
830 WEST EVELYN AVENUE
SUNNYVALE, CA 94086
Assignment: 2
Reel/Frame:
013163/0330Recorded: 08/05/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/29/2002
Assignee:
GROENEWOUDSEWEG 1
EINDHOVEN, NETHERLANDS 5621 BA
Correspondent:
PHILIPS ELECTRONICS NORTH AMERICA CORP.
MICHAEL SCHMITT
1000 W. MAUDE AVE.
SUNNYVALE, CA 94085
Assignment: 3
Reel/Frame:
018635/0787Recorded: 12/15/2006Pages: 51
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/17/2006
Assignee:
HIGH TECH CAMPUS 60
5656 AG EINDHOVEN, NETHERLANDS
Correspondent:
ELIZABETH PARSONS
1825 EYE STREET, NW
WASHINGTON, DC 20006

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