Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/08/2002
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Application #:
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09762478
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Filing Dt:
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02/07/2001
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Inventors:
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Seiki Sakuyama, Hiroki Uchida
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Title:
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SOLDER BUMP FORMING METHOD, ELECTRONIC COMPONENT MOUNTING
METHOD, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI, MCLELAND |
| & NAUGHTON, LLP |
| MEL R. QUINTOS |
| 1725 K STREET, N.W., SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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