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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
6461977
Issue Dt:
10/08/2002
Application #:
09417086
Filing Dt:
10/13/1999
Inventors:
HIROSHI MATSUO, TAKUJI ODA, YUICHI YOKOYAMA, KIYOSHI MAEDA, SHINYA INOUE, YUJI YAMAMOTO
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
038015/0012Recorded: 03/17/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MATSUO, HIROSHI
Exec Dt:
07/06/1998
ODA, TAKUJI
Exec Dt:
07/06/1998
YOKOYAMA, YUICHI
Exec Dt:
07/06/1998
MAEDA, KIYOSHI
Exec Dt:
07/06/1998
INOUE, SHINYA
Exec Dt:
07/06/1998
YAMAMOTO, YUJI
Exec Dt:
07/06/1998
Assignees:
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8310
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARA, ITAMI-SHI
HYOGO, JAPAN 664-0005
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
038090/0428Recorded: 03/24/2016Pages: 8
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS NAKA SEMICONDUCTOR CORP.
Exec Dt:
04/01/2014
Assignee:
RENESAS KANSAI SEMICONDUCTOR CO., LTD.
9-1, SEIRAN 2-CHOME, OTSU-SHI
SHIGA, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 3
Reel/Frame:
038090/0442Recorded: 03/24/2016Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS KANSAI SEMICONDUCTOR CO., LTD.
Exec Dt:
04/01/2014
Assignee:
RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
751, HORIGUCHI, HITACHINAKA-SHI
IBARAKI, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 4
Reel/Frame:
038240/0918Recorded: 03/24/2016Pages: 8
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Exec Dt:
04/01/2014
Assignee:
RENESAS NAKA SEMICONDUCTOR CORP.
730, HORIGUCHI, HITACHINAKA-SHI
IBARAKI, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 5
Reel/Frame:
038090/0466Recorded: 03/24/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
Exec Dt:
03/14/2016
Assignee:
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU
TOKYO, JAPAN 135-0061
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 6
Reel/Frame:
038137/0390Recorded: 03/30/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MITSUBISHI DENKI KABUSHIKI KAISHA
Exec Dt:
03/24/2016
Assignee:
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU
TOKYO, JAPAN 135-0061
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314

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