Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09691208
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Filing Dt:
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10/19/2000
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Inventor:
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Kazuma Sekiya
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Title:
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SEMICONDUCTOR WAFER DIVIDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OTA-KU |
| 14-3, HIGASHI KOJIYA 2-CHOME |
| TOKYO 144-8650, JAPAN |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| MICHAEL A. MAKUCH |
| 1850 M STREET, NW |
| SUITE 800 |
| WASHINGTON, DC 20036 |
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