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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/15/2002
Application #:
09806199
Filing Dt:
03/27/2001
Inventors:
Hashii Tomohiro, Onizaki Kazunori, Masuda Sumihisa
Title:
SEMICONDUCTOR WAFER MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
013008/0175Recorded: 06/19/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/15/2001
Exec Dt:
03/15/2001
Exec Dt:
03/19/2001
Assignee:
5-33 KITAHAMA, 4-CHOME CHUO-KU, OSAKA-SHI
OSAKA, JAPAN 541-0
Correspondent:
BREINER & BREINER, L.L.C.
MARY J. BREINER
115 NORTH HENRY STREET
P.O. BOX 19290
ALEXANDRIA, VIRGINIA 22320-0290
Assignment: 2
Reel/Frame:
013060/0349Recorded: 07/05/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/19/2002
Assignee:
1-2-1 SHIBAURA, MINATO-KU
TOKYO 105-8634, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN & HATTORI, LLP
DONALD W. HANSON
STE. 1000
1725 K STREET, N.W.
WASHINGTON, DC 20006

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