Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09387705
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Filing Dt:
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08/18/1999
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Inventors:
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KAZUHIRO TAKAHASHI, KAZUYOSHI EBE, SHINYA TAKYU
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Title:
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METHOD FOR GRINDING A WAFER BACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO 173-0001, JAPAN |
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| 72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
| KANAGAWA 210-8572, JAPAN |
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| WEBB ZIESENHEIM LOGSDON ET AL., P.C. |
| KENT E. BALDAUF |
| 700 KOPPERS BUILDING |
| 436 SEVENTH AVENUE |
| PITTSBURGH, PA 15219-1818 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE, NW SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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