Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09854559
|
Filing Dt:
|
05/15/2001
|
|
Publication #:
|
|
Pub Dt:
|
11/15/2001
| | | | |
|
Inventors:
|
Hiroshi Funakura, Eiichi Hosomi
|
|
Title:
|
SEMICONDUCTOR APPARATUS WITH IMPROVED THERMAL AND MECHANICAL CHARACTERISTIC UNDER-FILL
LAYER AND MANUFACTURING METHOD THEREFOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
|
|
|
|
| FINNEGAN, HENDERSON, FARABOW, ET AL |
| ERNEST F. CHAMPMAN |
| 1300 I STREET N.W. |
| WASHINGTON, DC 20005-3315 |
|
|
Search Results as of:
05/14/2024 10:35 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
