Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09874175
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Filing Dt:
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06/04/2001
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Inventors:
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Steven C. Avanzino, Pin-Chin Connie Wang, Minh Van Ngo
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Title:
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INTEGRATED CIRCUIT WITH DIELECTRIC DIFFUSION BARRIER LAYER FORMED BETWEEN INTERCONNECTS AND INTERLAYER DIELECTRIC LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 3453 |
| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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| THE LAW OFFICES OF MIKIO ISHIMARU |
| MIKIO ISHIMARU |
| 1110 SUNNYVALE-SARATOGA RD. |
| SUITE A1 |
| SUNNYVALE, CA 94087 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2485 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| CHRISTOPHER J. RECKAMP |
| 311 S. WACKER DRIVE |
| FAEGRE BAKER DANIELS LLP |
| CHICAGO, IL 60606 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 121 W. LONG LAKE ROAD |
| SUITE 300 |
| BLOOMFIELD HILLS, MICHIGAN 48304 |
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| FENG XU |
| 1526 GILPIN AVENUE |
| WILMINGTON, DE 19806 |
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