Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09900851
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Filing Dt:
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07/10/2001
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Inventors:
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Yang Wu, Chi-Chao Wan
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Title:
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SEED LAYER OF COPPER INTERCONNECTION VIA DISPLACEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F, NO. 301, SUNG-CHIANG RD. |
| TAIPEI ROC, TAIWAN |
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| BACON & THOMAS, PLLC |
| EUGENE MAR |
| 625 SLATERS LANE FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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