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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/10/2002
Application #:
09659969
Filing Dt:
09/12/2000
Inventor:
Osamu Suigihara
Title:
MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND WAFER BLOCK CONTACT BOARD
Assignment: 1
Reel/Frame:
011462/0629Recorded: 01/18/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/28/2000
Assignee:
7-5, NAKA OCHIAI 2-CHOME, SHINJUKI-KU
TOKYO, JAPAN
Correspondent:
COOK, ALEX, MCFARRON, MANZO, ET. AL.
EDWARD D. MANZO
200 WEST ADAMS STREET, SUITE 2850
CHICAGO, ILLINOIS 60606
Assignment: 2
Reel/Frame:
012608/0365Recorded: 02/14/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/27/2001
Exec Dt:
12/27/2001
Exec Dt:
12/27/2001
Exec Dt:
12/27/2001
Assignee:
7-5, NAKA-OCHIAI 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN
Correspondent:
COOK, ALEX, MCFARRON, MANZO, ET AL
EDWARD D. MANZO, ESQ.
200 WEST ADAMS STREET, SUITE 2850
CHICAGO, IL 60606

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