Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/17/2002
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Application #:
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09927564
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Filing Dt:
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08/09/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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Tsung-Ying Hsieh, Chin-Lien Hsu, Wen-Rui Hsu
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Title:
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FLIP CHIP PACKAGE OF MONOLITHIC MICROWAVE INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F, NO. 194, HUAN SHAN RD., NEI HU |
TAIPEI, TAIWAN R.O.C |
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MARTINE & PENILLA, LLP |
ALBERT S. PENILLA |
710 LAKEWAY DRIVE |
SUITE 170 |
SUNNYVALE, CA 94085 |
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