Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2002
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Application #:
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09140533
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Filing Dt:
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08/26/1998
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Inventors:
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TOSHIAKI YAMADA, TAKESHI TAKAHASHI, YOSHIYUKI YASUKAWA, KENJI ENDOU, SHIGERU ASAMI et al
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Title:
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HEAT RESISTANT, LOW DIELECTRIC POLYMERS, AND FILMS, SUBSTRATES, ELECTRONIC PARTS AND HEAT RESISTANT RESIN MOLDED PARTS USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-1, NIHONBASHI 1-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| 20-3, EBISU 4-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER ET AL |
| NORMAN F. OBLON |
| ATTORNEYS AT LAW, FOURTH FLOOR |
| 1755 JEFFERSON DAVIS HIGHWAY |
| ARLINGTON, VA 22202 |
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