Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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01/07/2003
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Application #:
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09410942
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Filing Dt:
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10/04/1999
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Inventor:
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WILLIAM KUANG-HUA SHU
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Title:
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DIE PAD CRACK ABSORPTION SYSTEM AND METHOD FOR INTEGRATED CIRCUIT CHIP FABRICATION
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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1251 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10020 |
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ELIZABETH PARSONS |
1825 EYE STREET, NW |
WASHINGTON, DC 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1109 MCKAY DRIVE |
SAN JOSE, CALIFORNIA 95131 |
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WAGNER, MURABITO & HAO LLP |
JOHN P. WAGNER, JR. |
TWO NORTH MARKET STREET |
THIRD FLOOR |
SAN JOSE, CA 95113 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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1251 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10020 |
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ELIZABETH PARSONS |
1825 EYE STREET, NW |
WASHINGTON, DC 20006 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HIGH TECH CAMPUS 60 |
5656 AG EINDHOVEN, NETHERLANDS |
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ELIZABETH PARSONS |
1825 EYE STREET, NW |
WASHINGTON, DC 20006 |
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Assignment:
5
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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DAVID M. O'DELL |
HAYNES AND BOONE, LLP - IP SECTION |
2323 VICTORY AVENUE, SUITE 700 |
DALLAS, TX 75219 |
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