Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/07/2003
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Application #:
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09867312
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Filing Dt:
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05/29/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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Brian E. Curcio, Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas
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Title:
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SOLID VIA LAYER TO LAYER INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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SCHMEISER, OLSEN & WATTS |
ARLEN L. OLSEN |
3 LEAR JET LANE |
SUITE 201 |
LATHAM, NY 12110 |
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