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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/18/2003
Application #:
09473384
Filing Dt:
12/28/1999
Inventors:
WESLEY R. ERCK, MICHAEL R. MAGEE, MICHAEL D. BEER
Title:
METHOD AND SYSTEM FOR VARYING DIE SHAPE TO INCREASE WAFER PRODUCTIVITY
Assignment: 1
Reel/Frame:
010689/0453Recorded: 03/15/2000Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/08/2000
Exec Dt:
03/13/2000
Exec Dt:
03/07/2000
Assignee:
1109 MCKAY DRIVE
SAN JOSE, CALIFORNIA 95131
Correspondent:
WAGNER, MURABITO & HAO LLP
JOHN P. WAGNER, JR.
TWO NORTH MARKET STREET
THIRD FLOOR
SAN JOSE, CA 95113
Assignment: 2
Reel/Frame:
013624/0072Recorded: 12/23/2002Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/16/2002
Assignee:
GROENEWOUDSEWEG 1
EINDHOVEN, NETHERLANDS 5621 BA
Correspondent:
PHILIPS ELECTRONICS NORTH AMERICA CORPOR
INTELLECTUAL PROPERTY & STANDARDS
1000 WEST MAUDE AVENUE
SUNNYVALE, CA 94085-2810

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