Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/11/2003
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Application #:
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09770666
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Filing Dt:
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01/29/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Inventors:
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Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno et al
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Title:
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MOLD FOR RESIN-SEALING OF SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8 |
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| 6-2, OOTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0 |
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| LEYDIG, VOIT & MAYER, LTD. |
| JEFFREY A. WYAND |
| 700 THIRTEENTH ST., N.W., SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-20-1 JOSUIHON-CHO, KODAIRA |
| TOKYO, JAPAN 187-8588 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN 135-0061 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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