Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09527743
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Filing Dt:
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03/17/2000
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Inventors:
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Ramachandra Divakaruni, Mark C. Hakey, William R. Tonti, William H.L. Ma et al
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Title:
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METHOD OF FORMING SOI STACKED DRAM LOGIC INCLUDING BONDING A SECOND WAFER TO A FIRST WAFER AND FORMING INTERCONNECTS BETWEEN THEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WHITHAM, CURTIS & WHITHAM, PLC |
| EUGENE L. SHKURKO |
| 11800 SUNRISE VALLEY DRIVE, SUITE 900 |
| RESTON, VA 20191 |
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