Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09757729
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Filing Dt:
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01/09/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Inventor:
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Edward G. Combs
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Title:
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MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD |
TSUEN WAN, NT, HONG KONG |
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SKJERVEN, MORRILL, MACPHERSON LLP |
EDWARD C. KWOK |
25 METRO DRIVE |
SUITE 700 |
SAN JOSE, CA 95110 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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28 FUI YIU KOK STREET |
UNIT E, 9/F METEX HOUSE |
TSUEN WAN, N.T., HONG KONG |
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MITCHELL M. WONG |
40 WALL STREET, FLOOR 28 |
THE EXETER LAW GROUP LLP |
NEW YORK, NY 10005 |
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Assignment:
3
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GRANT OF SECURITY INTEREST IN PATENT RIGHTS - FIRST PRIORITY
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P.O. BOX 2558 |
HOUSTON, TEXAS 77252 |
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MINDY M. LOK, ESQ. |
SIMPSON THACHER & BARTLETT LLP |
425 LEXINGTON AVENUE |
NEW YORK, NY 10017 |
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Assignment:
4
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GRANT OF SECURITY INTEREST IN PATENT RIGHTS - SECOND PRIORITY
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P.O. BOX 2558 |
HOUSTON, TEXAS 77252 |
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MINDY M. LOK, ESQ. |
SIMPSON THACHER & BARTLETT LLP |
425 LEXINGTON AVENUE |
NEW YORK, NY 10017 |
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Assignment:
5
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GRANT OF SECURITY INTEREST IN PATENT RIGHTS - SECOND PRIORITY
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HSBC MAIN BUILDING |
LEVEL 30, 1 QUEEN'S ROAD |
CENTRAL, HONG KONG |
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MINDY M. LOK, ESQ. |
SIMPSON THACHER & BARTLETT LLP |
425 LEXINGTON AVENUE |
NEW YORK, NY 10017 |
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