Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/06/2003
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Application #:
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09579822
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Filing Dt:
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05/25/2000
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Inventors:
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Kent Rossman, Zhuang Li, Young Lee
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Title:
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TRENCH FILL WITH HDP-CVD PROCESS INCLUDING COUPLED HIGH POWER DENSITY PLASMA DEPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEGAL AFFAIRS DEPARTMENT |
| PO BOX 450A, MS 2061 |
| SANTA CLARA, CALIFORNIA 95054 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| PATENT COUNSEL, M/S 2061 |
| LEGAL AFFAIRS DEPT., P.O. BOX 450A |
| SANTA CLARA, CA 95052 |
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