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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/20/2003
Application #:
09565554
Filing Dt:
05/05/2000
Inventors:
Masashi Shiraishi, Takeshi Wada, Mitsuyoshi Kawai
Title:
MANUFACTURING METHOD OF HEAD SUSPENSION ASSEMBLY WITH IC CHIP
Assignment: 1
Reel/Frame:
012628/0660Recorded: 03/01/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2000
Exec Dt:
04/28/2000
Exec Dt:
04/28/2000
Assignee:
1-13-1, NIHONBASHI, CHUO-KU
TOKYO 103-8272, JAPAN
Correspondent:
OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT
JOSEPH A. SCAFETTA, JR.
FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VA 22202

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