Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09750011
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Filing Dt:
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12/27/2000
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Publication #:
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Pub Dt:
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06/28/2001
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Inventors:
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Kenji Morita, Tomoharu Fujiwara
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Title:
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WAFER CHUCKS AND THE LIKE INCLUDING SUBSTRATE-ADHESION DETECTION AND ADHESION CORRECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FUJI BUILDING 2-3 MARUNOUCHI 3-CHOME |
| CHIYODA-KU, TOKYO 100, JAPAN |
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| KLARQUIST SPARKMAN CAMPBELL LEIGH & |
| WHINTSTON, LLP |
| DONALD L. STEPHENS, JR. |
| 121 S.W. SALMON STREET |
| PORTLAND, OREGON 97204-2988 |
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