Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09355517
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Filing Dt:
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07/30/1999
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Inventors:
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KENJI SHIMOKAWA, EIJI HASHINO, KOHEI TATSUMI
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Title:
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BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO 100-8071, JAPAN |
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| KENYON & KENYON |
| EDWARD W. GREASON |
| ONE BROADWAY |
| NEW YORK, NEW YORK 10004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1, SOTOKANDA, |
| CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| JOHN J. KELLY, JR. |
| KENYON & KENYON LLP |
| ONE BROADWAY |
| NEW YORK, NEW YORK 10004 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-5-5, SHIMODERA |
| NANIWA-KU, OSAKA-SHI |
| OSAKA, JAPAN |
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| PATRICK J BIRDE |
| 1 BROADWAY |
| KENYON & KENYON LLP |
| NEW YORK, NY 10004 |
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