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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/01/2003
Application #:
10057085
Filing Dt:
01/25/2002
Publication #:
Pub Dt:
05/01/2003
Inventors:
Tse-Yao Huang, Chih-Ching Lin, Yu-Chi Sun, Chang Rong Wu, Shing-Yih Shih
Title:
METHOD OF FORMING INTERCONNECTS
Assignment: 1
Reel/Frame:
012538/0155Recorded: 01/25/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Assignee:
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD.
KUEISHAN, TAOYUAN, TAIWAN R.O.C
Correspondent:
LADAS & PARRY
RICHARD P. BERG
5670 WILSHIRE BOULEVARD, #2100
LOS ANGELES, CALIFORNIA 90036-5679

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