Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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09838725
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Filing Dt:
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04/19/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Inventors:
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George Laing-Tai Chiu, John Harold Magerlein
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Title:
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SYSTEM ON A PACKAGE FABRICATED ON A SEMICONDUCTOR OR DIELECTRIC WAFER WITH WIRING ON ONE FACE, VIAS EXTENDING THROUGH THE WAFER, AND EXTERNAL CONNECTIONS ON THE OPPOSING FACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ALVIN J. RIDDLES |
| BOX 34 - CANDLEWOOD ISLE |
| NEW FAIRFIELD, CT. 06812 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 ZANKER ROAD |
| SAN JOSE, CALIFORNIA 95134 |
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| ALLSTON L. JONES |
| 425 SHERMAN AVENUE, SUITE 230 |
| PALO ALTO, CA 94306 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TERMINAL DRIVE |
| PLAINVIEW, NEW YORK 11803 |
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| ALAN P KASS |
| 394 ELIZABETH AVENUE |
| SOMERSET, NJ 08873 |
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