Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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10016919
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Filing Dt:
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12/07/2001
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Inventors:
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Kollengode S. Narayanan, Mohammad Eslamy
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Title:
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INCREASED SOLDER-BUMP HEIGHT FOR IMPROVED FLIP-CHIP BONDING AND RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| PENNIE & EDMONDS LLP |
| FRANCIS E. MORRIS |
| 1155 AVENUE OF AMERICAS |
| NEW YORK, NY 10036-2711 |
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