Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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10002022
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Filing Dt:
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10/31/2001
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Inventor:
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Taylor R. Efland
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Title:
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THERMALLY ENHANCED SEMICONDUCTOR CHIP HAVING INTEGRATED BONDS OVER ACTIVE CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474 MS 3999 |
| DALLAS, TEXAS 75265 |
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| GODWIN, GRUBER, P.C. |
| GARY C. HONEYCUTT |
| 801 E. CAMPBELL ROAD |
| SUITE 655 |
| RICHARDSON, TX 75081 |
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