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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/29/2003
Application #:
10188442
Filing Dt:
07/02/2002
Inventors:
Tsu Shih, Sung-Ming Jang
Title:
METHOD FOR FORMING METAL FILLED SEMICONDUCTOR FEATURES TO IMPROVE A SUBSEQUENT METAL CMP PROCESS
Assignment: 1
Reel/Frame:
013090/0771Recorded: 07/02/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/08/2002
Exec Dt:
04/08/2002
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO. 121 PARK AVENUE 3
HSIN-CHU, TAIWAN R.O.C
Correspondent:
TUNG & ASSOC.
RANDY W. TUNG
838 W. LONG LAKE RD., STE. 120
BLOOMFIELD, MI 48303

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